53 lines
1.5 KiB
Makefile
53 lines
1.5 KiB
Makefile
ccflags-$(CONFIG_USB_DWC3_DEBUG) := -DDEBUG
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ccflags-$(CONFIG_USB_DWC3_VERBOSE) += -DVERBOSE_DEBUG
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ccflags-y += -Idrivers/usb/host
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ccflags-y += -Idrivers/base/power
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obj-$(CONFIG_USB_DWC3) += dwc3.o
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dwc3-y := core.o
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dwc3-y += host.o
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dwc3-y += gadget.o ep0.o
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dwc3-y += dwc3_otg.o
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ifneq ($(CONFIG_DEBUG_FS),)
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dwc3-y += debugfs.o
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endif
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##
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# Platform-specific glue layers go here
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#
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# NOTICE: Make sure your glue layer doesn't depend on anything
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# which is arch-specific and that it compiles on all situations.
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#
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# We want to keep this requirement in order to be able to compile
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# the entire driver (with all its glue layers) on several architectures
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# and make sure it compiles fine. This will also help with allmodconfig
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# and allyesconfig builds.
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#
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# The only exception is the PCI glue layer, but that's only because
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# PCI doesn't provide nops if CONFIG_PCI isn't enabled.
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##
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obj-$(CONFIG_USB_DWC3_OMAP) += dwc3-omap.o
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obj-$(CONFIG_USB_DWC3_MSM) += dwc3-msm.o
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##
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# REVISIT Samsung Exynos platform needs the clk API which isn't
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# defined on all architectures. If we allow dwc3-exynos.c compile
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# always we will fail the linking phase on those architectures
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# which don't provide clk api implementation and that's unnaceptable.
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#
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# When Samsung's platform start supporting pm_runtime, this check
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# for HAVE_CLK should be removed.
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##
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ifneq ($(CONFIG_HAVE_CLK),)
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obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o
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endif
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ifneq ($(CONFIG_PCI),)
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obj-$(CONFIG_USB_DWC3) += dwc3-pci.o
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endif
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